- Libros
- The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages
- Libros
- The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages
The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages
KELLY, GERARD
English
The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages
KELLY, GERARDEAN
9780792384854
Editorial
Year of edition
1999
Idiom
English
Collection
SIN COLECCION
High
244
Width
170