- Libros
- Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys«
- Libros
- Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys«
Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys«
Guven, Ibrahim
Anglais
Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys«
Guven, IbrahimEAN
9781461349891
Éditorial
Année d'édition
2012
langage
Anglais
Collection
The Springer International Series in Engineering and Computer Science
Haute
235
Largeur
155